New Products
60-A multi-chip module family enables designers to meet stringent energy savings standards
April 17, 2012 | Paul Buckley | 222904457
Fairchild Semiconductor has developed the FDMF68xx Gen III DrMOS multi-chip module (MCM) family to meet the demands of new energy standards combined with new system specifications for blade servers, high performance notebooks, gaming consoles and POL modules.
Designed to enable a reduced inductor and output capacitor count, the FDMF68xx series saves up to 50 percent of board space as compared to conventional discrete solutions and improves efficiency to meet new energy standards. The FDMF68xx series reduces switch ringing, using Fairchild's high-performance PowerTrench MOSFET technology to eliminate the need for using a snubber circuit in most buck converter applications.
The Gen III DrMOS MCM family supports both 3.3 V and 5 V Tri-State PWM input voltages for both digital and analog PWM controllers and a 30 V device option makes the DrMOS adaptable for Notebook or UltraBook power systems. Providing better efficiency with over 1 MHz switching frequency, increased maximum load current, and greater power density, the Gen III DrMOS series achieves efficiency standards targets while providing up to 60 A per phase in a 6x6 mm2 PQFN package.
For more information about the FDMF68xx Gen III DrMOS multi-chip modules at
www.fairchildsemi.com/pf/FD/FDMF6820A.html
www.fairchildsemi.com/pf/FD/FDMF6820B.html
www.fairchildsemi.com/pf/FD/FDMF6820C.html
www.fairchildsemi.com/pf/FD/FDMF6823A.html
www.fairchildsemi.com/pf/FD/FDMF6823B.html
www.fairchildsemi.com/pf/FD/FDMF6823C.html
www.fairchildsemi.com/pf/FD/FDMF6833C.html
The Gen III DrMOS MCM family supports both 3.3 V and 5 V Tri-State PWM input voltages for both digital and analog PWM controllers and a 30 V device option makes the DrMOS adaptable for Notebook or UltraBook power systems. Providing better efficiency with over 1 MHz switching frequency, increased maximum load current, and greater power density, the Gen III DrMOS series achieves efficiency standards targets while providing up to 60 A per phase in a 6x6 mm2 PQFN package.
For more information about the FDMF68xx Gen III DrMOS multi-chip modules at
www.fairchildsemi.com/pf/FD/FDMF6820A.html
www.fairchildsemi.com/pf/FD/FDMF6820B.html
www.fairchildsemi.com/pf/FD/FDMF6820C.html
www.fairchildsemi.com/pf/FD/FDMF6823A.html
www.fairchildsemi.com/pf/FD/FDMF6823B.html
www.fairchildsemi.com/pf/FD/FDMF6823C.html
www.fairchildsemi.com/pf/FD/FDMF6833C.html
Please login to post your comment - click here
Related News
- World's lowest power Bluetooth smart chip is unveiled
- u-blox to develop 3G HSPA module based on Intel's XMM 6255 HSPA platform
- Ultra-low-power SoC supports world's smallest Bluetooth location stickers
- High temperature multilayer stacked capacitors offer high temperature reliability
- Altera acquires power technology innovator Enpirion
- TO-leadless package targets high current applications up to 300-A
- Infineon introduces TO 247-4 pin package for CoolMOS MOSFETs to improve efficiencies in hard switching topologies
- Automotive 3-phase power module enables higher torque systems for lower fuel consumption
- Superjunction MOSFET innovation brings the world's lowest RDS(on) to hard switching applications
- Silica starts roll out of design support strategy focused on power applications
MOST POPULAR NEWS
- Volvo evaluates flywheel hybrid drive - fuel savings of up to 25%
- PV storage market is set to grow to USD19bn by 2017
- Accutronics offers new custom battery service
- Nordic Semiconductor releases world's smallest Bluetooth low energy and ANT+ ICs
- Power-One enters into patent license agreement with Microchip
- Ultra-low-power SoC supports world's smallest Bluetooth location stickers
- Quad-MOSFET solution boosts efficiency and eliminates heat sinking in active bridge applications
- Market for GaN and SiC power semiconductors set to rise by factor of 18 in next decade
- Solar industry capital spending hits seven-year low in 2013 but upturn is on the cards
- Advanced microcontroller combines floating point and low leakage technology to achieve longest battery lifetime in portable applications
Interview
Technical papers
- Dangers of Aftermarket Counterfeit Battery Packs
- High Voltage Surge Stoppers Ensure Reliable Operation During Power Surges
- Motor-Drive Design made Simple
- Adaptive Cell Converter Topology Enables Constant Efficiency in PFC Applications
- Micropower Isolated Flyback Converter with Input Voltage Range from 6V to 100V
- Derating of Schottky Diodes
- Heatsink Optimization
- High Performance ZVS Buck Regulator Removes Barriers To Increased Power Throughput
- Waste heat replaces batteries
- Stepper Motor Control IC
Poll
Diodes
Linear Technology
NXP Semiconductors
Fairchild Semiconductor
Analog
Photovoltaic
Solar
STMicroelectronics
GaN
Power Supplies
Smart Grid
Power Supply
MOSFET
Batteries
Intersil
International Rectifier
UPS
Analog Devices
IMS Research
Energy Harvesting
Microcontrollers
Battery
Maxim Integrated Products
Power
MOSFETs
Power Management
Microcontroller
Texas Instruments
Vishay Intertechnology
National Semiconductor
All material on this site Copyright © 2009 - 2010 European Business Press SA. All rights reserved.
This site contains articles under license from EETimes Group , a division of United Business Media LLC.
This site contains articles under license from EETimes Group , a division of United Business Media LLC.


