Fairchild licenses power transistor packaging technology from Infineon
The package is designed for use in high-current automotive applications, including battery management for hybrid vehicles, Electric Power Steering (EPS), active alternators and other heavy load electrical systems. The TO-Leadless package is the first package enabling current capabilities of 300A. It also offers significant benefits in terms of board space compared to the current D²PAK package, with a more than 20 percent smaller as well as 50 percent lower package height.
Automotive electronics companies developing new start-stop systems, electric power steering, battery management and active alternators to address higher efficiency and lower emission regulations seek innovative solutions, but must also minimize the risk that comes with products available only from one supplier. To ensure a reliable supply, Fairchild and Infineon entered into this agreement in order to bring the leading-edge TO-Leadless MOSFET solution to the automotive market while also minimizing the risk associated with single-supplier sourcing.
Fairchild will deploy the TO-Leadless power package technology with its latest MOSFET technologies and expects to sample the first MOSFETs in TO-Leadless packages in second half of 2012, with production devices available in mid-2013.
“With this agreement, the automotive industry benefits from a reliable second-source supplier base for a high-current power device that provides many benefits in terms of space, efficiency and performance,” commented Jochen Hanebeck, president of the Automotive Division at Infineon.
Further information on the JEDEC standard of the H-PSOF TO-Leadless package under http://www.jedec.org/. Please search for MO-299A.pdf.
- Infineon Technologies completes International Rectifier acquisition
- UMC to manufacture automotive power devices for Infineon
- Infineon offers high-power module IP royalty-free, to spread adoption
- 120A from a TO-247 package; Infineon’s TO-247PLUS for IGBTs
- Fairchild claims world’s first 1000-Volt integrated power switch
- TO-247 4 Kelvin-sense package cuts IGBT switching losses
- Pixel chip sparks energy-efficient intelligent LED headlamps
- IGBTs and MOSFETs continue to drive power semiconductor growth
- Will Infineon's power IC gambit pay off?
- Fairchild reinvents itself
- Infineon's secret weapon: Dresden Fab, 48V car battery
- Infineon grabs lead in power MOSFET sector
- Infineon closes technology gap through International Rectifier takeover
- Infineon fires on all cylinders
- DC power grid taps electronic circuit breaker research
- Are next generation EV batteries a step closer?
- Are power management researchers really 21st century alchemists?
- First round-the-world solar plane flight prepares for take-off
- GaN: The dawn of a new era?
- Long life aluminium-air battery resolves rechargeable challenges
- Solar-powered radio chip monitors windows to save energy
- How to measure capacity versus bias voltage on MLCCs
- Bamboo bike uses peddle power to recharge smartphones
- Apple Watch spurs wireless charging growth in 2015
- Product How-to: Ultra-low noise linear regulators for powering PLL/VCO and clocking ICs
- Hybrid fuel cell advance boosts power by 20 percent
- Conquering the 'kink' in sub-threshold power MOSFET behavior: A simple compact modeling approach
- Multi-crystalline silicon PV module claims power output world record
- Tesla Roadster targest 400-mile range with one charge
- World's first G.fast reverse power feeding is demonstrated
- Investigating Die attach Failure in IGBTs using Power Cycling Tests
- Power Systems Design eBook
- Wireless Power User Guide
- A Novel Approach to Industrial Rectifier Systems
- Smartphone SoC Power Efficiency - DVFS Capacitor Switching
- Power Modules: The New Super Power
- Digital Power Management Reduces Energy Costs While Improving System Performance