eeTimes
eeTimes
eeTimes eeTimes eeTimes
Forgot password Register
Print - Send - -

New Products

Fairchild licenses power transistor packaging technology from Infineon

April 03, 2012 | Christoph Hammerschmidt | 222904391
Fairchild licenses power transistor packaging technology from Infineon Infineon Technologies and Fairchild Semiconductor have signed a licensing agreement on Infineon's advanced automotive MOSFET packaging technology H-PSOF (Heatsink Plastic Small Outline Flat Lead), a JEDEC standard TO-Leadless package (MO-299). Fairchild plans to deploy the package for its latest MOSFET devices.

The package is designed for use in high-current automotive applications, including battery management for hybrid vehicles, Electric Power Steering (EPS), active alternators and other heavy load electrical systems. The TO-Leadless package is the first package enabling current capabilities of 300A. It also offers significant benefits in terms of board space compared to the current D²PAK package, with a more than 20 percent smaller as well as 50 percent lower package height.

Automotive electronics companies developing new start-stop systems, electric power steering, battery management and active alternators to address higher efficiency and lower emission regulations seek innovative solutions, but must also minimize the risk that comes with products available only from one supplier. To ensure a reliable supply, Fairchild and Infineon entered into this agreement in order to bring the leading-edge TO-Leadless MOSFET solution to the automotive market while also minimizing the risk associated with single-supplier sourcing.

Fairchild will deploy the TO-Leadless power package technology with its latest MOSFET technologies and expects to sample the first MOSFETs in TO-Leadless packages in second half of 2012, with production devices available in mid-2013.

“With this agreement, the automotive industry benefits from a reliable second-source supplier base for a high-current power device that provides many benefits in terms of space, efficiency and performance,” commented  Jochen Hanebeck, president of the Automotive Division at Infineon.

Further information on the JEDEC standard of the H-PSOF TO-Leadless package under http://www.jedec.org/. Please search for MO-299A.pdf.

 










Please login to post your comment - click here
Related News
MOST POPULAR NEWS
Interview
Technical papers
Poll
Do you find reference designs help speed your design cycle?