Technology News
Flexible glass enables development of thinner displays and lighting objects
An ultra-slim flexible glass could revolutionize the shape and form of next-generation consumer electronic technologies, including displays and perhaps OLED luminaries: The Corning Willow Glass, introduced by chemical company Corning Inc. The company made the announcement today at the Society for Information Display's Display Week, an industry tradeshow in Boston.
Corning Willow Glass will enable thin, light and cost-efficient applications including today's slim displays and the smart surfaces of the future. The thinness, strength, and flexibility of the glass has the potential to enable displays to be “wrapped” around a device or structure. As well, the material can be processed at temperatures up to 500° C. High temperature processing capability is essential for today's high-end displays, and is a processing condition that cannot be supported with polymer films. Corning Willow Glass will enable the industry to pursue high-temperature, continuous roll-to-roll processes – similar to how newsprint is produced – that have been impossible until now.
It will enable the design of thinner backplanes and color filters for both organic light emitting diodes (OLED) and liquid crystal displays (LCD) in high-performance, portable devices such as smartphones, tablets, and notebook computers. This flexible glass will also help develop conformable (curved) displays for immersive viewing or mounting on non-flat surfaces.
Corning Willow Glass is formulated to perform exceptionally well for electronic components such as touch sensors, as well as leveraging glass's natural hermetic properties as a seal for OLED displays and other moisture and oxygen-sensitive technologies.
“Displays become more pervasive each day and manufacturers strive to make both portable devices and larger displays thinner. Corning Willow Glass provides the substrate performance to maintain device quality in a thin and light form factor,” said Dipak Chowdhury, division vice president and Willow Glass program director. “Currently manufacturing in a sheet-to-sheet process, we expect Corning Willow Glass to eventually allow customers to switch to high-throughput, efficient roll-to-roll processing, a long-awaited industry milestone.”
Corning Willow Glass is produced using the company’s proprietary fusion process. Advances in fusion forming have made it possible to produce glass that is 100 microns thick – about the thickness of a sheet of copy paper. Even at that thickness, it provides hermetic sealing to sensitive components, while also providing excellent optical, thermal, and surface properties.
Corning is currently shipping samples of its Willow Glass to customers developing new display and touch applications. The company is also collaborating with research institutions, customers, and equipment makers to develop an ecosystem of compatible process equipment, including optimized process design.
Although initially being launched as an advanced display substrate, Corning is actively working on other potential applications for its Willow Glass, including use in lighting and flexible solar cells.
For more information, please see www.corning.com/WILLOW.
- Printed, flexible and organic electronics will enjoy a solid growth over the next decade says IDTechEx
- 1-A single-phase bridge rectifiers feature reverse voltages to 1000-V in MBLS package for smartphone chargers
- Fully flexible design platform helps OEMs validate new energy harvesting cell concepts
- Spatial atomic conformal layer deposition targets flexible electronics
- Flexible battery-connector solution with cable connection
- Integrating CMOS devices into flexible substrates for medical implants
- Method could pave way for lower cost, more flexible devices
- Heliatek opens production facility for the manufacture of organic solar films
- Holst Centre, imec launch research program on flexible OLED displays
- Dow Corning enters long-term silane supply deal with Air Products
- Volvo evaluates flywheel hybrid drive - fuel savings of up to 25%
- PV storage market is set to grow to USD19bn by 2017
- Accutronics offers new custom battery service
- Nordic Semiconductor releases world's smallest Bluetooth low energy and ANT+ ICs
- Power-One enters into patent license agreement with Microchip
- Ultra-low-power SoC supports world's smallest Bluetooth location stickers
- Quad-MOSFET solution boosts efficiency and eliminates heat sinking in active bridge applications
- Market for GaN and SiC power semiconductors set to rise by factor of 18 in next decade
- Solar industry capital spending hits seven-year low in 2013 but upturn is on the cards
- Advanced microcontroller combines floating point and low leakage technology to achieve longest battery lifetime in portable applications
- Dangers of Aftermarket Counterfeit Battery Packs
- High Voltage Surge Stoppers Ensure Reliable Operation During Power Surges
- Motor-Drive Design made Simple
- Adaptive Cell Converter Topology Enables Constant Efficiency in PFC Applications
- Micropower Isolated Flyback Converter with Input Voltage Range from 6V to 100V
- Derating of Schottky Diodes
- Heatsink Optimization
- High Performance ZVS Buck Regulator Removes Barriers To Increased Power Throughput
- Waste heat replaces batteries
- Stepper Motor Control IC
Microcontroller
Maxim Integrated Products
Vishay Intertechnology
Solar
Power
NXP Semiconductors
Battery
National Semiconductor
Analog Devices
Linear Technology
Diodes
Batteries
STMicroelectronics
Power Management
MOSFETs
UPS
IMS Research
Texas Instruments
GaN
Intersil
International Rectifier
Fairchild Semiconductor
Photovoltaic
Power Supply
MOSFET
Microcontrollers
Smart Grid
Power Supplies
Analog
Energy Harvesting
This site contains articles under license from EETimes Group , a division of United Business Media LLC.


