New Products
Leaded laminate copper-moly-copper base packages dissipates heat from high power compound semiconductor devices
The LL family of leaded laminate copper-moly-copper (CMC) base packages from StratEdge dissipates heat from high power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC).
These packages handle applications through 6 GHz for use in RF radios for communications, radar, and high power millimeter-wave signals. The series includes two laminate power packages, both with a ratio of 1:3:1 CMC, which provides a good thermal match for alumina-based materials and a GaN chip. The LL802302 is 20.32x9.91mm wide with 2 leads and a raised lid with an epoxy seal. This is a flange package with a bolt hole on each end so the package can be bolted to the printed circuit board. The LL362302 is a flangeless, fully hermetic version of the LL802302 package, and has a flat ceramic lid. StratEdge offers both flange and flangeless styles to accommodate manufacturing processes to either bolt down or solder the package. Hermeticity is especially critical in aerospace and defense applications.
Visit StratEdge at www.stratedge.com
- J1-Series power modules feature compact 6-in-1 package for use in electric and hybrid vehicles
- 1-A single-phase bridge rectifiers feature reverse voltages to 1000-V in MBLS package for smartphone chargers
- Nordic Semiconductor releases world's smallest Bluetooth low energy and ANT+ ICs
- Mini dual-inline-package intelligent power modules target industrial applications
- Power cord integrates locking system for IEC inlets
- Roll clad strips with adhesive copper-aluminium bonds act as battery cell connector
- Chip-embedded packaging integrates DC/DC driver and MOSFET VR power stage
- 2.5x2.5mm FPGA draws only 25-microwatt for portable systems
- Power switch can take 10A in a TO-257 package at up to 225°C
- Maxim Integrated partners Freescale to showcase a comprehensive outdoor LTE/3G picocell base station
- KTH The Royal Institute of Technology develops world's first water-activated charging device for mobile phones
- Volvo evaluates flywheel hybrid drive - fuel savings of up to 25%
- PV storage market is set to grow to USD19bn by 2017
- Energy harvesting wireless switch transmits on-off data over a 300m range at 868MHz
- Accutronics offers new custom battery service
- Nordic Semiconductor releases world's smallest Bluetooth low energy and ANT+ ICs
- Power-One enters into patent license agreement with Microchip
- Quad-MOSFET solution boosts efficiency and eliminates heat sinking in active bridge applications
- Advanced microcontroller combines floating point and low leakage technology to achieve longest battery lifetime in portable applications
- Market for GaN and SiC power semiconductors set to rise by factor of 18 in next decade
- High Voltage Surge Stoppers Ensure Reliable Operation During Power Surges
- Motor-Drive Design made Simple
- Adaptive Cell Converter Topology Enables Constant Efficiency in PFC Applications
- Micropower Isolated Flyback Converter with Input Voltage Range from 6V to 100V
- Derating of Schottky Diodes
- Heatsink Optimization
- High Performance ZVS Buck Regulator Removes Barriers To Increased Power Throughput
- Waste heat replaces batteries
- Stepper Motor Control IC
- 50Ω Gain Block IF Amplifier
Photovoltaic
Diodes
Fairchild Semiconductor
Microcontroller
Intersil
International Rectifier
Microcontrollers
Power Supply
Vishay Intertechnology
IMS Research
NXP Semiconductors
STMicroelectronics
Linear Technology
Battery
SoC
Texas Instruments
Energy Harvesting
National Semiconductor
Analog
MOSFET
Analog Devices
MOSFETs
Smart Grid
Power Supplies
Power Management
Maxim Integrated Products
UPS
Power
Solar
Batteries
This site contains articles under license from EETimes Group , a division of United Business Media LLC.
