Technology News
NXP claims industry's most efficient low-VF schottky rectifier for mobile devices
April 04, 2012 | Paul Buckley | 222904401
NXP Semiconductors N.V. has launched what the company claims are the most efficient Schottky rectifier available in the ultra-small and flat 1.0 x 0.6 x 0.37-mm plastic SMD package DFN1006D-2 (SOD882D).
The 20-V, 0.5-A PMEG2005BELD Schottky barrier rectifier is the smallest on the market with a maximum forward voltage of 390 mV at 0.5-A forward current, offering increased battery life and performance. With high-efficiency electrical characteristics never before reached in this size, the low VF Schottky rectifier is ideal for mobile, battery-driven devices such as smartphones and tablets that need to reduce overall power consumption in limited PCB board space. The ultra-compact Schottky rectifier combines a low forward voltage and a low reverse current of only 50 µA at 10-V reverse forward and is ideal for backlighting displays in smartphones, MP3 players and tablet PCs.
“Board space inside today’s smartphones is very limited. We designed this latest low-VF Schottky rectifier based on customer requests to put the characteristics of products two generations larger into a smaller 1006 (0402)-sized plastic package without sacrificing performance. As a result, we have set a new benchmark for low forward voltage in this small leadless package, offering 20 percent more efficiency than other products available in this size range. To achieve these excellent electrical parameters, we had to optimize the silicon wafer process and package assembly,” said Dr. Wolfgang Bindke, product marketing manager for diodes at NXP Semiconductors.
Robust and compact, the PMEG2005BELD features NXP’s tin-plated, solderable side pads. The tin-plated side pads are attractive to manufacturers because they enable visual inspection of solder joints. Solderable side pads also allow for tighter contact onto the PCB with less tilting and stronger shear force robustness.
More information about the PMEG2005BELD Low VF MEGA Schottky barrier rectifier at www.nxp.com/pip/PMEG2005BELD
“Board space inside today’s smartphones is very limited. We designed this latest low-VF Schottky rectifier based on customer requests to put the characteristics of products two generations larger into a smaller 1006 (0402)-sized plastic package without sacrificing performance. As a result, we have set a new benchmark for low forward voltage in this small leadless package, offering 20 percent more efficiency than other products available in this size range. To achieve these excellent electrical parameters, we had to optimize the silicon wafer process and package assembly,” said Dr. Wolfgang Bindke, product marketing manager for diodes at NXP Semiconductors.
Robust and compact, the PMEG2005BELD features NXP’s tin-plated, solderable side pads. The tin-plated side pads are attractive to manufacturers because they enable visual inspection of solder joints. Solderable side pads also allow for tighter contact onto the PCB with less tilting and stronger shear force robustness.
More information about the PMEG2005BELD Low VF MEGA Schottky barrier rectifier at www.nxp.com/pip/PMEG2005BELD
Please login to post your comment - click here
Related News
- Ultra-low-power SoC supports world's smallest Bluetooth location stickers
- Imec and Renesas collaborate on ultra-low power short range radios
- PIN power diodes combine low recovery losses and softness for efficiency and low EMI
- sureCore receives £250 000 SMART Award to prototype low power SRAM technology
- Miniature 30-V MOSFETs claim industry-leading RDS(ON) performance
- Highest power GaN in Plastic transistors target radar and communications systems
- Amantys partners Fuji Electric to launch IGBT gate drivers for wind and solar markets
- Ultra-low noise, high PSRR linear voltage regulators reduce jitter, simplify power design
- Altera acquires power technology innovator Enpirion
- Non-contact current probes target advanced power designs
MOST POPULAR NEWS
- Volvo evaluates flywheel hybrid drive - fuel savings of up to 25%
- PV storage market is set to grow to USD19bn by 2017
- Accutronics offers new custom battery service
- Nordic Semiconductor releases world's smallest Bluetooth low energy and ANT+ ICs
- Power-One enters into patent license agreement with Microchip
- Quad-MOSFET solution boosts efficiency and eliminates heat sinking in active bridge applications
- Advanced microcontroller combines floating point and low leakage technology to achieve longest battery lifetime in portable applications
- Power MOSFETs are 80 percent smaller than conventional chips while offering better thermal dissipation
- Market for GaN and SiC power semiconductors set to rise by factor of 18 in next decade
- Research project to strengthen Europe's role as power semiconductor production site kicks off at Infineon in Villach
Interview
Technical papers
- High Voltage Surge Stoppers Ensure Reliable Operation During Power Surges
- Motor-Drive Design made Simple
- Adaptive Cell Converter Topology Enables Constant Efficiency in PFC Applications
- Micropower Isolated Flyback Converter with Input Voltage Range from 6V to 100V
- Derating of Schottky Diodes
- Heatsink Optimization
- High Performance ZVS Buck Regulator Removes Barriers To Increased Power Throughput
- Waste heat replaces batteries
- Stepper Motor Control IC
- 50Ω Gain Block IF Amplifier
Poll
National Semiconductor
Texas Instruments
Microcontrollers
Analog
SoC
Analog Devices
Fairchild Semiconductor
Diodes
Batteries
Power Supply
Intersil
Maxim Integrated Products
Vishay Intertechnology
Photovoltaic
STMicroelectronics
Power Supplies
NXP Semiconductors
MOSFET
Energy Harvesting
Battery
UPS
Solar
Microcontroller
Smart Grid
MOSFETs
Power Management
Power
International Rectifier
IMS Research
Linear Technology
All material on this site Copyright © 2009 - 2010 European Business Press SA. All rights reserved.
This site contains articles under license from EETimes Group , a division of United Business Media LLC.
This site contains articles under license from EETimes Group , a division of United Business Media LLC.


