Technology News
NXP claims industry's most efficient low-VF schottky rectifier for mobile devices
April 04, 2012 | Paul Buckley | 222904401
NXP Semiconductors N.V. has launched what the company claims are the most efficient Schottky rectifier available in the ultra-small and flat 1.0 x 0.6 x 0.37-mm plastic SMD package DFN1006D-2 (SOD882D).
The 20-V, 0.5-A PMEG2005BELD Schottky barrier rectifier is the smallest on the market with a maximum forward voltage of 390 mV at 0.5-A forward current, offering increased battery life and performance. With high-efficiency electrical characteristics never before reached in this size, the low VF Schottky rectifier is ideal for mobile, battery-driven devices such as smartphones and tablets that need to reduce overall power consumption in limited PCB board space. The ultra-compact Schottky rectifier combines a low forward voltage and a low reverse current of only 50 µA at 10-V reverse forward and is ideal for backlighting displays in smartphones, MP3 players and tablet PCs.
“Board space inside today’s smartphones is very limited. We designed this latest low-VF Schottky rectifier based on customer requests to put the characteristics of products two generations larger into a smaller 1006 (0402)-sized plastic package without sacrificing performance. As a result, we have set a new benchmark for low forward voltage in this small leadless package, offering 20 percent more efficiency than other products available in this size range. To achieve these excellent electrical parameters, we had to optimize the silicon wafer process and package assembly,” said Dr. Wolfgang Bindke, product marketing manager for diodes at NXP Semiconductors.
Robust and compact, the PMEG2005BELD features NXP’s tin-plated, solderable side pads. The tin-plated side pads are attractive to manufacturers because they enable visual inspection of solder joints. Solderable side pads also allow for tighter contact onto the PCB with less tilting and stronger shear force robustness.
More information about the PMEG2005BELD Low VF MEGA Schottky barrier rectifier at www.nxp.com/pip/PMEG2005BELD
“Board space inside today’s smartphones is very limited. We designed this latest low-VF Schottky rectifier based on customer requests to put the characteristics of products two generations larger into a smaller 1006 (0402)-sized plastic package without sacrificing performance. As a result, we have set a new benchmark for low forward voltage in this small leadless package, offering 20 percent more efficiency than other products available in this size range. To achieve these excellent electrical parameters, we had to optimize the silicon wafer process and package assembly,” said Dr. Wolfgang Bindke, product marketing manager for diodes at NXP Semiconductors.
Robust and compact, the PMEG2005BELD features NXP’s tin-plated, solderable side pads. The tin-plated side pads are attractive to manufacturers because they enable visual inspection of solder joints. Solderable side pads also allow for tighter contact onto the PCB with less tilting and stronger shear force robustness.
More information about the PMEG2005BELD Low VF MEGA Schottky barrier rectifier at www.nxp.com/pip/PMEG2005BELD
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