March 2, 2012 NXP Semiconductors N.V. has released the LPC1100XL microcontroller series featuring extra-low power. With the industry’s lowest active power consumption at 110 uA/MHz and reduced deep sleep current below 2 µA, the LPC1100XL has set a new benchmark for low-power ARM Cortex-M0 microcontrollers. Read more

February 17, 2012 NXP Semiconductors N.V. has unveiled what the company claims is the world’s first dimmable fluorescent lamp driver IC for High Frequency Tube Lamps (HF-TL) combining power factor correction (PFC) controller and ballast driver circuits. Using the boost function of the UBA2016A, high-end commercial-grade amalgam-based tube lamps will have a run-up time almost similar to mercury-based tube lamps. Read more

February 14, 2012 NXP Semiconductors N.V. is releasing the world’s first ARM Cortex-M0 microcontroller with dual supply voltage of 1.65 V to 1.95 V V DD and 1.65 V to 3.6 V V IO . The company’s new LPC1100LV series offers 50 MIPS performance in a 2-mm x 2-mm footprint with over three times power reduction compared to similar 3.3 V V DD devices. The LPC1100LV platform is specifically designed for battery-powered end applications ranging from mobile phones, tablets, Ultrabooks and mobile accessories to active cable, cameras, and portable medical electronics. Read more

February 8, 2012 NXP Semiconductors N.V. has unveiled several cost-effective SPF (smart power flyback) ICs available in small packages, including the GreenChip SPF TEA1731. In addition, NXP has introduced a new GreenChip synchronous rectification (SR) control IC, the TEA1792. The company has also made some new additions to the TEA172x family that also offers no-load performance. Read more

February 8, 2012 NXP Semiconductors is showcasing a wide range of highly efficient Power MOSFETs at APEC 2012 which can be used alongside the company's GreenChip switched-mode power supply (SMPS) controller ICs, to enable slimmer power supply, adapter and charger designs. Read more

February 8, 2012 NXP Semiconductors N.V. has unveiled the GreenChip SPR TEA1716 switched-mode power supply (SMPS) controller IC which the company claims is the industry’s first resonant PFC and LLC combo controller enabling ultra-low standby power at low loads, compliant with EU Ecodesign Directive requirements taking effect in 2013. Read more

February 3, 2012 NXP Semiconductors is claiming a major new benchmark in miniaturization with the launch of the company’s next-generation family of low VF Schottky rectifiers targeting the mobile device market. With a typical thickness of just 0.37 mm and an outline of 1.6 x 0.8 mm, the new DFN1608D-2 (SOD1608) plastic package claims to be the smallest on the market that is capable of carrying a current of up to 1.5 A. Read more

January 6, 2012 Treehouse Labs has unveiled the BiKN Technology Platform which uses low-power wireless chip technology from NXP Semiconductors N.V. to enable the 'Internet of Things ', opening entirely new markets and applications for affordable wireless sensor and control networks.  The platform aims to revolutionize the way mobile networks and applications for control, tracking and monitoring are delivered. Read more

November 30, 2011 NXP Semiconductors N.V. has introduced the LPC11U2x series – the first microcontroller based on the ARM Cortex -M0 processor to offer integrated USB class drivers. By integrating multiple USB drivers in ROM, the LPC11U2x maximizes Flash memory utilization, saving up to 16 KB of code space while providing fully tested and easy-to-use APIs to enable USB integration in a matter of minutes. Read more

November 21, 2011 NXP Semiconductors N.V. has introduced the industry’s first medium power transistors in a 2-mm x 2-mm 3-pin leadless DFN package. Offering a solution in an ultra-small DFN2020-3 (SOT1061) Surface-Mounted Device (SMD) plastic package, the BC69PA transistor is the first in a family of medium power transistors from NXP available in a miniature form factor. Read more

November 16, 2011 In this news analysis article EE Times Europe Analog's editor, Paul Buckley questions Jan Jaap Bezemer, NXP Semiconductors' director of marketing, microcontroller product line, as to the reasons for NXP Semiconductors unveiling a series of new low-pin-count package options for the company's market-leading ARM Cortex-M0 LPC1100 family of microcontrollers.  Read more

November 15, 2011 NXP Semiconductors N.V. has introduced the first member of a new generation of high-performance proximity contactless reader ICs. The CLRC663 combines robust multi-protocol support with the highest RF output power and patented groundbreaking low-power card detection technology. Driven by the market needs for higher integration, smaller housings and interoperability, the CLRC663 has been designed for use in a wide variety of infrastructure use cases such as banking, eGovernment, transport and mobile payment. Read more

November 14, 2011 NXP Semiconductors N.V. has introduced two new automotive audio amplifiers supporting energy-saving start-stop systems – the TDF8530 and TDF8546. The TDF8530 is an ultra-efficient quad-channel Class-D audio amplifier supporting the 6 V requirement for start-stop vehicles. Read more

October 28, 2011 NXP Semiconductors N.V., has introduced a series of new low-pin-count package options for the company’s market-leading ARM Cortex-M0 LPC1100 family of microcontrollers which aims to open the door for a broader range of applications previously closed to typical 32-bit MCUs due to package footprint or manufacturing constraints. The new LPC111x devices, which feature SO20, TSSOP20, TSSOP28 and DIP28 options, claim to be the world’s first 32-bit ARM microcontrollers in low-pin-count packages. Read more

October 20, 2011 NXP Semiconductors N.V. has introduced the LD6806CX4 ultra low-dropout voltage regulator (LDO), featuring ultra-low dropout of only 60 mV at a 200-mA current rating. With an ultra-small 0.76 x 0.76 x 0.47mm wafer-level chip-scale package (WLCSP), the LD6806CX4 uses minimal board space, making it ideal for space-constrained designs in mobile handsets, where battery life is also a critical success factor. Read more

September 22, 2011 NXP Semiconductors N.V. has introduced the TFF101xHN, a family of integrated downconverters for use in Low Noise Block (LNB) 10.7-GHz to 12.75-GHz Ku band satellite receiver systems. Designed for downlink signal reception for TV satellite dishes, NXP’s new family of DVB-S compliant downconverters consume 50-percent less current (52 mA) than other integrated solutions, and increase the lifetime of the LNB and improving its reliability. Read more

September 8, 2011 Low-power wireless chip technology from NXP Semiconductors N.V. is being used the HyGreen Hand Hygiene and Recording System, designed by HyGreen, to capture and transmit data on hand washing by healthcare workers, helping to improve hospital hygiene.  The innovative solution actively reminds busy healthcare workers to wash their hands, and records all hand-washing events and patient-staff interactions in the hospital environment. Read more

September 6, 2011 Germany’s seven partners of the ‘EnLight’ (Energy Efficient and Intelligent Lighting Systems) research project are aiming to reduce energy consumption of today’s LED systems by up to an additional 40 percent. Read more

September 1, 2011 Consumer chip company MediaTek Inc., has announced it has achieved a design win with consumer electronics company Koninklijke Philips Electronics NV and is planning to develop "a long-term and close partnership with Philips." Read more

August 19, 2011 NXP Semiconductors N.V. has unveiled the first NWP ISO 11898-6 and AUTOSAR R3.2.1 compliant solution supporting CAN Partial Networking which will help reduce CO2 emissions from vehicles and produce environmentally-friendly solutions. Read more

August 11, 2011 NXP Semiconductors N.V. has unveiled the PBSM5240PF, an ultra-compact Medium Power transistor and N-channel Trench MOSFET housed in a leadless DFN2020-6 (SOT1118) plastic package. Measuring 2 x 2 mm and with a height of 0.65 mm, the DFN2020-6 (SOT1118) has been designed in response to the industry trend for miniaturization in high-performance consumer products such as mobile devices. Read more

July 20, 2011 NXP Semiconductors has unveiled the IP4786CZ32, a highly integrated HDMI signal-conditioning IC which claims to provide the industry's highest levels of protection for HDMI 1.4 transmitter applications. Featuring a Transmission Line Clamping architecture that provides lower peak clamping voltages during an ESD strike, the IP4786 delivers strong ESD protection, and claims the best signal integrity and the highest level of integration available in the industry today. Read more

July 14, 2011 NXP Semiconductors N.V. has unveiled the company’s next generation of CAN transceivers with the introduction of the dual high-speed (HS) CAN transceiver, TJA1048. Enabling simpler and more efficient in-vehicle networking design, the TJA1048 is a performance and space optimized solution for electronic control units (ECUs) used in safety, comfort and environment-friendly automotive applications that carry more than one HS-CAN communication interface. Read more

June 8, 2011 NXP Semiconductors N.V. has unveiled its new XR family of LDMOS RF power transistors which has been to withstand the harsh fault conditions often found in applications such as industrial lasers, metal etching and concrete drilling. Read more

June 6, 2011 NXP Semiconductors N.V. is showcasing at IMS2011 a live demo of its next-generation products based on Gallium Nitride (GaN) technology. The GaN demo includes a 50-W wideband amplifier, the CLF1G0530-50, covering 500 to 3000 MHz; 2.1-GHz and 2.7-GHz Doherty power amplifiers for base stations; and a 100-W amplifier, the CLF1G2535-100, covering 2.5 - 3.5 GHz. Read more

June 6, 2011 NXP Semiconductors N.V. has launched a complete line of overmolded plastic (OMP) RF power devices with peak powers ranging from 2.5 to 200 Watts. The new range of OMP devices have been introduced as a complement to NXP’s extensive range of products in ceramic packages, providing customers a choice for more cost-sensitive applications, while maintaining the required level of RF performance. Read more

May 23, 2011 NXP Semiconductors N.V. has begun shipping 15 new devices in the NextPower range of 25 V and 30 V MOSFETs in its LFPAK package. The latest additions to NXP’s power MOSFET portfolio deliver balanced characteristics across the six most important parameters for high-performance, high-reliability switching applications, while providing the industry’s lowest RDS(on) with sub-1 mΩ types in both 25 V and 30 V. Read more

May 16, 2011 NXP Semiconductors has introduced its GreenChip smart lighting solution that makes the Internet-enabled, energy-efficient lighting network a reality – not only for businesses, but also for consumers trying to make the most of energy savings in the home. Read more

April 21, 2011 NXP Semiconductors N.V. is adding to the company’s broad GreenChip SSL family of products, the GreenChip SSL4101T controller IC, which offers new levels of professional-grade performance for Solid State LED lighting power supplies. The GreenChip SSL4101T enables LED lighting for medium to high power commercial and professional applications with industry-leading performance in Total Harmonic Distortion (THD) of less than 20 percent, a high Power Factor (PF) of .99, and high efficiency of 94 percent. Read more

March 23, 2011 NXP Semiconductors N.V. has introduced a LIN transceiver family with an integrated low-drop voltage regulator in a small 3x3 mm leadless package. The TJA1028 is designed to power an automotive Electronic Control Unit (ECU), integrating the major peripheral functions around the microcontroller of a typical LIN-networked ECU into a single chip. Read more

March 15, 2011 NXP Semiconductors N.V. has released a multiplexer/demultiplexer (mux/demux) switch featuring what the company claims is the highest speed implementation in the industry. Providing switching speeds of up to 10 Gbps, the CBTL02043 maintains low power consumption and low power loss, and is designed to support rapidly evolving high-speed computing standards for desktop, mobile and enterprise systems such as PCIe Gen3, USB3.0, DisplayPort v1.2 and SAS/SATA 6 Gbps. Read more

March 8, 2011 NXP Semiconductors N.V. has released a new generation of GreenChip power solutions which claim to feature the lowest standby capability in the industry, reaching levels below 10 mW. The NXP GreenChip power ICs, also known as Switch Mode Power Supply controller ICs, are designed for adapters for mobile devices such as cell phone chargers, tablets and notebooks, as well as major home appliances or white goods. Read more

February 22, 2011 NXP Semiconductors N.V. has unveiled its LPC1200 Industrial Control Series featuring the ARM Cortex-M0 processor which extends NXP’s 32-bit ARM microcontroller continuum and targets a wide range of industrial applications in the areas of factory and home automation, such as white goods, motor control, power conversion and power supplies. Read more

January 21, 2011 The CGV series of JESD204A-compliant data converters from NXP Semiconductors N.V. are now interoperable with Nujira's OpenET envelope tracking (ET) and digital pre-distortion (DPD) solutions. Read more

January 10, 2011 NXP Semiconductors N.V. is inviting RF engineers and students worldwide to submit creative application ideas for RF power devices as part of the company’s first-ever High Performance RF Design Challenge. Read more

November 30, 2010 NXP Semiconductors N.V. has unveiled the first MOSFET in the company's NextPower range with a 30 V Power-SO8 MOSFET, which claims the industry's lowest RDSon of 1.4 mOhm at 4.5 V. The new MOSFET, PSMN1R0-30YLC, is optimized for 4.5 V switching applications and is packaged in LFPAK, the industry's toughest Power-SO8 package. Read more

November 30, 2010 austriamicrosystems is collaborating with NXP Semiconductors N.V. to jointly develop the first in a range of reference solutions for product authentication in embedded consumer applications. Applying the AS399x UHF RFID Reader IC, and the UCODE G2iL series, the reference design claims to deliver the industry's lowest power consumption, lowest solution cost, lowest complexity and highest level of integration. Read more

November 4, 2010 NXP Semiconductors N.V., has released of a new generation of non-dimmable CFL driver ICs for 230 V and 110 V fluorescent lamps based on GreenChip technology. The UBA2211 offers a fully integrated CFL driver along with a current controlled preheat function, enabling more compact fluorescent lamp designs, highly efficient power conversion, and extended CFL lifetimes in the range of 12,000 to 15,000 hours. Read more

October 19, 2010 NXP Semiconductors N.V. has unveiled new microcontrollers, which the company claims set new benchmarks in 32-bit active power consumption. The LPC1100L and LPC1300L series introduce a new low-power platform which combines ultra-low leakage design techniques with NXP's optimised power-efficient libraries. Read more

October 11, 2010 NXP Semiconductors N.V., has unveiled what the company claims is the world’s first 32-bit ARM-based solution designed specifically for non-billing electricity metering applications. Read more

September 23, 2010 NXP Semiconductors N.V., has unveiled an Ultra High Frequency (UHF) RF power transistor which is a 600 W LDMOS device for broadcast transmitters and industrial applications. Read more

September 20, 2010 NXP Semiconductors N.V., has released what the company claims is the industry's highest performance ARM Cortex-M3 microcontroller. The LPC1800 is optimized for low power operation at low frequencies all the way through to 150 MHz maximum performance from either Flash or RAM. Read more

June 24, 2010 NXP Semiconductors is extending its Transient Voltage Suppressor (TVS) diodes portfolio by 35 new products housed in its 2-lead FlatPower package SOD128 (3.8 x 2.5 x 1 mm). Read more

May 12, 2010 NXP Semiconductors is launching a series of new products developed in the latest SiGe (silicon-germanium) process technology that are designed to target high frequency radio applications. Read more

April 19, 2010 NXP Semiconductors claims to be the first supplier to launch a full range of automotive power MOSFETs housed in the compact, thermally enhanced Loss Free PAcKage (LFPAK). Read more

April 12, 2010 NXP Semiconductors plans to demonstrate working silicon of its newest microcontrollers based on the ARM Cortex-M4 processor at ESC Silicon Valley 2010. Read more