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Power MOSFET shrinks board space with chip scale packaging technology

May 30, 2012 | Paul Buckley | 222904664
Power MOSFET shrinks board space with chip scale packaging technology Alpha and Omega Semiconductor Limited (AOS) has released the a high performance 30 V p-channel Power MOSFET offered in a compact 1.6 mm x 1.6 mm chip scale package.
The AOC2411 features a low on-resistance of 45 mOhms and is ideally suited for battery powered applications that push the limits of size and performance such as the latest smart phones, tablet PCs, eBook readers, UltraBooks and other mobile Internet devices.

The AOC2411 reduces the amount of utilized board space by 70% while reducing the package height by 50% when compared to an industry standard TSOP6 package of similar electrical performance. This form factor reduction provides designers of power management circuitry with an ideal and cost-effective solution for minimizing board space in ultra-portable applications.

Availability and Pricing

The AOC2411 is immediately available in production quantities with a lead-time of 12 weeks.  The unit price for 1,000 pieces is $0.35.

Visit AOS at www.aosmd.com










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