New Products
TI's new multicore DSPs pack performance and low power in small form factor
March 27, 2012 | Paul Buckley | 222904351
Texas Instruments Incorporated has unveiled three devices based on its KeyStone multicore architecture utilizing the TMS320C66x DSP generation. TI’s new TMS320C665x DSPs feature combined fixed- and floating-point capabilities, delivering real-time high performance at low power coupled with smaller form factors.
With TI’s new TMS320C6654, TMS320C6655 and TMS320C6657 multicore DSPs, developers can more effectively meet vital requirements of high performance and portable applications in markets such as mission critical, industrial automation, testers, embedded vision, imaging, video surveillance, medical, audio and video infrastructure.
Based on the KeyStone multicore architecture, TI’s new C665x processors offer developers access to devices that are high performance while still being power and space efficient. The low power consumption and small form factor of 21 mm x 21 mm enable portability, mobility and low power energy sources such as battery and interface powering to drive breakthrough products. The strengths of these C665x DSPs meet the need of applications such as video security and traffic management, where there is a need to carry out both video processing and analytics at the end point. In addition, a wide range of high performance real-time applications such as on-board radar, software defined radios, video and image processing and portable ultrasound will now be smaller, lighter and easier to use.
TI’s C665x DSPs also feature large on-chip memory coupled with a high bandwidth and efficient external memory controller, making them an ideal choice for developers of mission critical, test and automation, imaging, medical and audio and video infrastructure applications where low latency is critical.
The new DSPs support extended temperature ranges from -55 to 100°C for applications required to work under extreme physical conditions or provide sustained operating life. This feature makes the C665x DSPs ideal for mission critical, outdoor imaging and analytics applications, where high reliability is a key requirement. In addition, the C665x DSPs provide abundant performance and connectivity to tackle the challenging specifications in imaging applications, including high bandwidth serial interfaces such as RapidIO, PCIe and Gigabit Ethernet and the ability to extend processing to a pool of DSPs. An optimized set of peripherals, including Universal Parallel Port (UPP) and Multichannel Buffered Serial Ports (McBSP), in TI’s C665x processors, reduce system cost and size, as well as simplify migration from previous designs with minimal board redesign.
TI offers easy-to-use, low cost evaluation modules (EVMs) so developers can quickly get started designing with the C6654, C6655 and C6657. The TMDSEVM6657 sells for $349 and the TMDSEVM6657LE sells for $549. Both EVMs include a free Multicore Software Development Kit ( MCSDK) , TI’s powerful Code Composer Studio (CCS) integrated development environment (IDE), and suite of application/demo codes to allow programmers to quickly come up to speed on the new platform. In addition, TI’s TMDSEVM6657L includes an embedded XDS100 emulator while the TMDSEVM6657LE includes a faster emulator, the XDS560V2, for quicker program load and ease of use.
In addition, C665x DSPs are code compatible with TI’s TMS320C64x generation and all of TI’s KeyStone-based multicore processors, ensuring previous investments made on TI DSPs can be easily reused. This flexibility allows developers the ability to easily design a wide portfolio of high performance products, scaling from low to high end applications.
Availability and Pricing
Starting just under $30 at 10 KU, TI’s C665x processors consist of three fully pin compatible low-cost, power optimized solutions for developers migrating from single core to multicore. The C6657 features two 1.25-GHz DSP cores, delivering up to 80 GMACs and 40 GFLOPs, while the C6655 and C6654 single core solutions deliver up to 40 GMACs and 20 GLOPS and 27.2 GMACs and 13.6 GLOPS, respectively. Under normal operating conditions, the C6657, C6655 and C6654 power numbers are at 3.5 W, 2.5 W and 2 W, respectively.
Order entry is open today for both the C665x EVMS, as well as the C665x devices. Pricing for the C6654 DSP starts just under $30 for 10 KU.
More information about the KeyStone multicore architecture visit www.ti.com/multicore
Based on the KeyStone multicore architecture, TI’s new C665x processors offer developers access to devices that are high performance while still being power and space efficient. The low power consumption and small form factor of 21 mm x 21 mm enable portability, mobility and low power energy sources such as battery and interface powering to drive breakthrough products. The strengths of these C665x DSPs meet the need of applications such as video security and traffic management, where there is a need to carry out both video processing and analytics at the end point. In addition, a wide range of high performance real-time applications such as on-board radar, software defined radios, video and image processing and portable ultrasound will now be smaller, lighter and easier to use.
TI’s C665x DSPs also feature large on-chip memory coupled with a high bandwidth and efficient external memory controller, making them an ideal choice for developers of mission critical, test and automation, imaging, medical and audio and video infrastructure applications where low latency is critical.
The new DSPs support extended temperature ranges from -55 to 100°C for applications required to work under extreme physical conditions or provide sustained operating life. This feature makes the C665x DSPs ideal for mission critical, outdoor imaging and analytics applications, where high reliability is a key requirement. In addition, the C665x DSPs provide abundant performance and connectivity to tackle the challenging specifications in imaging applications, including high bandwidth serial interfaces such as RapidIO, PCIe and Gigabit Ethernet and the ability to extend processing to a pool of DSPs. An optimized set of peripherals, including Universal Parallel Port (UPP) and Multichannel Buffered Serial Ports (McBSP), in TI’s C665x processors, reduce system cost and size, as well as simplify migration from previous designs with minimal board redesign.
TI offers easy-to-use, low cost evaluation modules (EVMs) so developers can quickly get started designing with the C6654, C6655 and C6657. The TMDSEVM6657 sells for $349 and the TMDSEVM6657LE sells for $549. Both EVMs include a free Multicore Software Development Kit ( MCSDK) , TI’s powerful Code Composer Studio (CCS) integrated development environment (IDE), and suite of application/demo codes to allow programmers to quickly come up to speed on the new platform. In addition, TI’s TMDSEVM6657L includes an embedded XDS100 emulator while the TMDSEVM6657LE includes a faster emulator, the XDS560V2, for quicker program load and ease of use.
In addition, C665x DSPs are code compatible with TI’s TMS320C64x generation and all of TI’s KeyStone-based multicore processors, ensuring previous investments made on TI DSPs can be easily reused. This flexibility allows developers the ability to easily design a wide portfolio of high performance products, scaling from low to high end applications.
Availability and Pricing
Starting just under $30 at 10 KU, TI’s C665x processors consist of three fully pin compatible low-cost, power optimized solutions for developers migrating from single core to multicore. The C6657 features two 1.25-GHz DSP cores, delivering up to 80 GMACs and 40 GFLOPs, while the C6655 and C6654 single core solutions deliver up to 40 GMACs and 20 GLOPS and 27.2 GMACs and 13.6 GLOPS, respectively. Under normal operating conditions, the C6657, C6655 and C6654 power numbers are at 3.5 W, 2.5 W and 2 W, respectively.
Order entry is open today for both the C665x EVMS, as well as the C665x devices. Pricing for the C6654 DSP starts just under $30 for 10 KU.
More information about the KeyStone multicore architecture visit www.ti.com/multicore
Please login to post your comment - click here
Related News
- Nujira surpasses own world record for ET PA linearity
- PCIe clock generators offer the smallest footprint and lowest power
- 60-V integrated power modules extends power capability of low load-impedance Class D audio systems
- Expanded ecosystem of ultra-low power MCUs speeds capacitive touch design development
- PFC IC enables compact designs for consumer products and PCs
- Radiation hardened DC-DC power conversion devices support space power systems
- 650-V n-channel power MOSFET series adds 23 new high power density devices
- LED power supply suits hand-held devices
- Integrated PFC IC for compact consumer products
- 420-W quarter brick DC-DC converters are PMBus compliant
MOST POPULAR NEWS
- Volvo evaluates flywheel hybrid drive - fuel savings of up to 25%
- PV storage market is set to grow to USD19bn by 2017
- Ultra-low-power SoC supports world's smallest Bluetooth location stickers
- Power-One enters into patent license agreement with Microchip
- Quad-MOSFET solution boosts efficiency and eliminates heat sinking in active bridge applications
- Imec and Renesas collaborate on ultra-low power short range radios
- Solar industry capital spending hits seven-year low in 2013 but upturn is on the cards
- Market for GaN and SiC power semiconductors set to rise by factor of 18 in next decade
- Advanced microcontroller combines floating point and low leakage technology to achieve longest battery lifetime in portable applications
- World's lowest power Bluetooth smart chip is unveiled
Interview
Technical papers
- Dangers of Aftermarket Counterfeit Battery Packs
- High Voltage Surge Stoppers Ensure Reliable Operation During Power Surges
- Motor-Drive Design made Simple
- Adaptive Cell Converter Topology Enables Constant Efficiency in PFC Applications
- Micropower Isolated Flyback Converter with Input Voltage Range from 6V to 100V
- Derating of Schottky Diodes
- Heatsink Optimization
- High Performance ZVS Buck Regulator Removes Barriers To Increased Power Throughput
- Waste heat replaces batteries
- Stepper Motor Control IC
Poll
Linear Technology
Battery
Power Supply
Maxim Integrated Products
Analog
Microcontroller
Fairchild Semiconductor
NXP Semiconductors
Vishay Intertechnology
STMicroelectronics
Power
Texas Instruments
Diodes
Smart Grid
Intersil
Batteries
National Semiconductor
Microcontrollers
Photovoltaic
MOSFETs
UPS
MOSFET
Solar
Energy Harvesting
Analog Devices
Power Management
Power Supplies
GaN
International Rectifier
IMS Research
All material on this site Copyright © 2009 - 2010 European Business Press SA. All rights reserved.
This site contains articles under license from EETimes Group , a division of United Business Media LLC.
This site contains articles under license from EETimes Group , a division of United Business Media LLC.


