The new ICs feature the industry’s first 0.13-micron BCD tailored for portable devices that deliver increased component density and enabling higher voltage power management integration.
The BCD process can support the integration of advanced logic, analog and high-voltage features, including FET type transistors. The process will also enable Dialog to create even more highly integrated, smaller form factor single chip devices optimized for portable products such as tablet PCs, ultrabooks and smart phones. The transition to 0.13-micron enhances a PMICs power efficiency through a reduction of Rds(on), leading to more energy efficient integrated circuit (IC) designs.
“Through close collaboration with TSMC we succeeded to increase our chip shipments by a staggering 61 percent last year, while at the same time accelerating the development of our next generation of PMICs through this BCD process partnership,” said Dr. Jalal Bagherli, CEO of Dialog Semiconductor. “We will continue to work closely with TSMC to fuel our leadership position as the analog industry moves towards 300mm wafers.”
A broad range of proprietary Dialog IP blocks, based on the TSMC 0.13-micron BCD process, have already been developed for incorporation into Dialog’s next generation PMICs, and are currently being qualified with the first devices expected to be available by the end of the year. The designs will deliver the industry’s leading power management performance for portable devices.
Visit Dialog Semiconductor at www.dialog-semiconductor.com
Visit TSMC at www.tsmc.com