Reinforced solder preforms increase bond line co-planarity

March 08, 2017 // By Julien Happich
Indium Corporation is redefining solder with its InFORMS solder preforms, composites consisting of solder and a reinforcing matrix that, together, increase lateral strength and bond line co-planarity while improving thermal cycling reliability.

When InFORMS were used to solder a DBC to the baseplate of an IGBT, one study showed 4x improved thermal cycling reliability compared to a solder preform-only approach  and 2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach. The reinforced solder preform also reduces voiding to less than 1%. As a drop-in replacement for a standard preform or solder paste, InFORMS require no additional process steps or equipment.

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